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has selected NEC Electronics' 90nanometer (nm) CMOScompatible embedded DRAM (eDRAM) technology for Wii. its innovative new video game console. ...

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Nintendo's New Wii Video Game Console Uses NEC Electronics' Embedded DRAMPage 1Nintendo's New Wii Video Game Console Uses NEC Electronics'Embedded DRAMKAWASAKI Japan SANTA CLARA Calif. June 19 2006 NEC Electronics today announced that Nintendo Co. Ltd. has selected NEC Electronics' 90nanometer (nm) CMOScompatible embedded DRAM (eDRAM) technology for Wii its innovative new video game console. Designed to provide advanced graphics functions for this new gamingplatform the new system LSI chips with eDRAM will be manufactured using advanced technologies on NEC Yamagata's 300millimeter (mm) production lines. Embedded DRAM technology integrates DRAM on the same chip with logic circuits and is viewed as an optimalsolution for threedimensional (3D) graphics acceleration systems and other applications that need to process highbandwidth data using low power. In the past the integration of an eDRAM structure with a standard CMOS process proved challenging. NEC Electronics achieved its fully CMOScompatible eDRAM technology by integrating a metalinsulatormetal 2 (MIM2) stacked DRAM capacitor on the company's standard CMOS process.NEC Electronics first introduced MIM2 technology on 90 nm eDRAM in 2005 and volume production started that same year. The technology requires a material with a high dielectric constant to be placed between two electrodes and a large charge to be maintained on the capacitor with low leakage and a small cell size. NEC Electronics has achieved this by 1) using a MIM structure for the electrodes in the DRAM cell to achieve lower resistance values and higher data processing speeds 2) using cobaltsilicide (CoSi) DRAM cell transistors to increase driving performance and 3) using zirconiumoxide (ZrO2) in the capacitance layer (ahead of other vendors) to increase capacitance of the unit area. These and other breakthroughs have allowed NEC Electronics to develop eDRAM chips using its mostadvanced 90 nm process and to secure its roadmap to 55 nm eDRAM and beyond ...

Source: www.necus.com

 

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